Title :
Laser Soldering of Glass Materials Using Diode Laser
Author :
Kasch, S. ; Muller, Holger ; Wachter, S.
Author_Institution :
Inst. of Joining Technol. & Mater. Testing, Jena
Abstract :
Glass plates have to be interconnected hermetically for certain applications, so that the functional elements in it are protected against oxygen and moisture. Furthermore limits are set to the joining process by temperature sensibility of the encapsulating functional elements. The low-temperature process "adhesive bonding" used so far does not offer the demanded tightness and long-term stability. The present investigations concentrate on alternative joining methods using laser beams
Keywords :
glass; laser beam welding; semiconductor lasers; soldering; diode laser; glass materials; joining process; laser soldering; temperature sensibility; Bonding; Diode lasers; Glass; Hermetic seals; Joining processes; Moisture; Optical materials; Protection; Soldering; Temperature sensors;
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
DOI :
10.1109/ESTC.2006.280062
