DocumentCode
460289
Title
Laser Soldering of Glass Materials Using Diode Laser
Author
Kasch, S. ; Muller, Holger ; Wachter, S.
Author_Institution
Inst. of Joining Technol. & Mater. Testing, Jena
Volume
1
fYear
2006
fDate
5-7 Sept. 2006
Firstpage
583
Lastpage
588
Abstract
Glass plates have to be interconnected hermetically for certain applications, so that the functional elements in it are protected against oxygen and moisture. Furthermore limits are set to the joining process by temperature sensibility of the encapsulating functional elements. The low-temperature process "adhesive bonding" used so far does not offer the demanded tightness and long-term stability. The present investigations concentrate on alternative joining methods using laser beams
Keywords
glass; laser beam welding; semiconductor lasers; soldering; diode laser; glass materials; joining process; laser soldering; temperature sensibility; Bonding; Diode lasers; Glass; Hermetic seals; Joining processes; Moisture; Optical materials; Protection; Soldering; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location
Dresden
Print_ISBN
1-4244-0552-1
Electronic_ISBN
1-4244-0553-x
Type
conf
DOI
10.1109/ESTC.2006.280062
Filename
4060786
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