DocumentCode
460296
Title
Automatic and Secure Rework in a Lead-Free Environment
Author
Affolter, Bruno
Author_Institution
ZEVAC AG, Solothurn
Volume
1
fYear
2006
fDate
5-7 Sept. 2006
Firstpage
624
Lastpage
628
Abstract
The evolution of electronic components as well as the lead-free changeover is a challenge for the production. In addition to that, we need to focus on the same issues also in rework processes. In the field of automated rework, it´s indispensable to master a handful of important process parameters in order to get reliable and repeatable results. ZEVAC AG as a market leader for rework platforms has dealt with that topic in early times. The article shows how to convert the obtained know-how in high-quality products for automatic rework
Keywords
soldering; ZEVAC AG; automatic rework; electronic components; lead-free changeover; lead-free environment; secure rework; Assembly; Cooling; Electronic packaging thermal management; Electronics packaging; Environmentally friendly manufacturing techniques; Heating; Lead; Production systems; Soldering; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location
Dresden
Print_ISBN
1-4244-0552-1
Electronic_ISBN
1-4244-0553-x
Type
conf
DOI
10.1109/ESTC.2006.280069
Filename
4060793
Link To Document