DocumentCode
461383
Title
Experimental Study of Temperature Dependence of Program/Erase Endurance of Embedded Flash Memories with 2T-FNFN Device Architecture
Author
Tao, Guoqiao ; Chauveau, Helene ; Nath, Som
Author_Institution
NXP Semicond., Nijmegen
fYear
2006
fDate
Oct. 16 2006-Sept. 19 2006
Firstpage
76
Lastpage
79
Abstract
Most of the flash endurance results reported so far are typically in a temperature range of -40degC to +85degC, while devices in automotive "under the hood" applications can experience up to 150degC. This paper reports the temperature dependence of FN/FN based flash memories. Experiments have been carried out on 2.7Mb test memory arrays with temperatures up to 150degC. An empirical model has been developed to describe the temperature dependent degradation of the Vt window. This model fits the experimental data over the whole temperature range, and the endurance performance with single shot P/E cycles exceeds 1 million cycles
Keywords
embedded systems; flash memories; memory architecture; -40 to 85 C; 2.7 MByte; 2T-FNFN device architecture; FN/FN based flash memories; embedded flash memories; program/erase endurance; temperature dependence; Automotive engineering; Character generation; Degradation; Electrons; Flash memory; Interface states; Manufacturing; Temperature dependence; Temperature distribution; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 2006 IEEE International
Conference_Location
South Lake Tahoe, CA
ISSN
1930-8841
Print_ISBN
1-4244-0296-4
Electronic_ISBN
1930-8841
Type
conf
DOI
10.1109/IRWS.2006.305215
Filename
4098692
Link To Document