• DocumentCode
    461383
  • Title

    Experimental Study of Temperature Dependence of Program/Erase Endurance of Embedded Flash Memories with 2T-FNFN Device Architecture

  • Author

    Tao, Guoqiao ; Chauveau, Helene ; Nath, Som

  • Author_Institution
    NXP Semicond., Nijmegen
  • fYear
    2006
  • fDate
    Oct. 16 2006-Sept. 19 2006
  • Firstpage
    76
  • Lastpage
    79
  • Abstract
    Most of the flash endurance results reported so far are typically in a temperature range of -40degC to +85degC, while devices in automotive "under the hood" applications can experience up to 150degC. This paper reports the temperature dependence of FN/FN based flash memories. Experiments have been carried out on 2.7Mb test memory arrays with temperatures up to 150degC. An empirical model has been developed to describe the temperature dependent degradation of the Vt window. This model fits the experimental data over the whole temperature range, and the endurance performance with single shot P/E cycles exceeds 1 million cycles
  • Keywords
    embedded systems; flash memories; memory architecture; -40 to 85 C; 2.7 MByte; 2T-FNFN device architecture; FN/FN based flash memories; embedded flash memories; program/erase endurance; temperature dependence; Automotive engineering; Character generation; Degradation; Electrons; Flash memory; Interface states; Manufacturing; Temperature dependence; Temperature distribution; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 2006 IEEE International
  • Conference_Location
    South Lake Tahoe, CA
  • ISSN
    1930-8841
  • Print_ISBN
    1-4244-0296-4
  • Electronic_ISBN
    1930-8841
  • Type

    conf

  • DOI
    10.1109/IRWS.2006.305215
  • Filename
    4098692