• DocumentCode
    462437
  • Title

    Module integration on the inner shells (TIB) of the CMS tracker

  • Author

    Genta, Chiara

  • Author_Institution
    Universita degli Studi di Firenze
  • Volume
    2
  • fYear
    2006
  • fDate
    Oct. 29 2006-Nov. 1 2006
  • Firstpage
    902
  • Lastpage
    905
  • Abstract
    The CMS experiment will be installed on the LHC ring. The accelerator will provide pp collisions at the center of mass energy of 14 TeV with a design luminosity of 1034 cm-2 s-1 and a bunch crossing frequency of 40 MHz. These characteristics lead to a challenging design of the detectors, in particular of the tracker which will have to cope with ~2000 charged tracks per event and a hadron flux up to 1014 cm-2 y-1 close to the interaction point. Moreover the CMS tracker shall endure 10 years of operation, with little or no chance for maintenance after LHC start-up. It is therefore important not only to verify accurately the quality of the components during the production, but also to monitor step by step the assembly of modules and of the other devices that constitute the final detector. The "integration" procedure used to assemble and test the innermost region of the detector (modules, electronics and services, mechanics...) is described in detail and the noise performances of the modules mounted on the assembled layers is shown.
  • Keywords
    nuclear electronics; particle track visualisation; silicon radiation detectors; 14 TeV; 40 MHz; CMS tracker; LHC ring; accelerator; bunch crossing frequency; design luminosity; high-energy collision; inner shells; microstrip detector; module integration; noise performances; nuclear electronics; proton-proton collisions; silicon radiation detector; Assembly; Collision mitigation; Detectors; Electronic equipment testing; Event detection; Frequency; Large Hadron Collider; Monitoring; Performance evaluation; Production; CMS; LHC; Micro-strip; Silicon; Tracker;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nuclear Science Symposium Conference Record, 2006. IEEE
  • Conference_Location
    San Diego, CA
  • ISSN
    1095-7863
  • Print_ISBN
    1-4244-0560-2
  • Electronic_ISBN
    1095-7863
  • Type

    conf

  • DOI
    10.1109/NSSMIC.2006.355992
  • Filename
    4179146