Reliability Assessment on Insertion Mount Assembly under Vibration Conditions

Author

Qi, Haiyu ; Plaza, Gustavo ; Ganesan, Sanka ; Osterman, Michael ; Pecht, Michael

Author_Institution

Dell Inc., Round Rock

fYear

2007

fDate

May 29 2007-June 1 2007

Firstpage

407

Lastpage

414

Abstract

This paper presents the reliability design-of-experiment and results for an insertion-mount assembly under random vibration loading conditions. The natural frequency and overstress limits were first identified for the test vehicle. The durability of assemblies with Sn37Pb (SnPb) and Sn3.0Ag0.5Cu (SAC) solder joints was compared under aging conditions that vary on temperature and duration: 125degC for 100 hours, 125degC for 350 hours, -55degC for 1000 hours. The effects of aging and printed circuit board pad finishes on solder joint reliability were also investigated. The results show that SnPb solder joints have better performance than SAC solder joints, especially under high-vibration loading conditions and with thermal aging treatment. Pad finishes were also found to contribute to diffusion in assembly reliability but with different trends for differently aged products.

Keywords

ageing; assembling; circuit reliability; design of experiments; printed circuit testing; prosthetic power supplies; solders; surface mount technology; vibrations; SnAgCu; SnPb; aging; assembly reliability; high-vibration loading conditions; insertion mount assembly; printed circuit board; reliability assessment; reliability design-of-experiment; solder joint reliability; temperature -55 degC; temperature 125 degC; thermal aging treatment; time 100 hour; time 1000 hour; time 350 hour; vibration conditions; Aging; Assembly; Automotive engineering; Copper; Packaging; Printed circuits; Soldering; Temperature; Testing; Vehicles;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th

Conference_Location

Reno, NV

ISSN

0569-5503

Print_ISBN

1-4244-0985-3

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2007.373829

Filename

4249915