DocumentCode
464799
Title
Impact of strain on the design of low-power high-speed circuits
Author
Ramakrishnan, H. ; Maharatna, K. ; Chattopadhyay, S. ; Yakovlev, A.
Author_Institution
Sch. of Electr., Electron. & Comput. Eng., Newcastle Univ.
fYear
2007
fDate
27-30 May 2007
Firstpage
1153
Lastpage
1156
Abstract
In this article, we explore the impact of strain on circuit performance when strained silicon (s-Si) devices are used for designing low-power high-speed circuits. Emphasis has been given on the evaluation of noise characteristics and low-power performance along with the delay characteristics under different channel straining conditions. An inverter circuit has been used for performance evaluation through simulation where the device simulator is calibrated with experimental device data. The result shows a great promise for s-Si technology in digital applications which require high throughput and low power.
Keywords
high-speed integrated circuits; integrated circuit design; invertors; silicon; channel straining conditions; delay characteristics; inverter circuit; low-power high-speed circuits; noise characteristics; performance evaluation; s-Si devices; strained silicon devices; CMOS technology; Calibration; Capacitive sensors; Circuit simulation; Design engineering; Germanium silicon alloys; Inverters; Silicon germanium; Tensile strain; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 2007. ISCAS 2007. IEEE International Symposium on
Conference_Location
New Orleans, LA
Print_ISBN
1-4244-0920-9
Electronic_ISBN
1-4244-0921-7
Type
conf
DOI
10.1109/ISCAS.2007.378254
Filename
4252844
Link To Document