Title :
CAD Implications of New Interconnect Technologies
Author :
Scheffer, Louis K.
Author_Institution :
Cadence, San Jose
Abstract :
This paper looks at the CAD implications of possible new interconnect technologies. We consider three technologies in particular: three dimensional ICs, carbon nanotubes as a replacement for metal interconnects, and optical interconnections for longer range on-chip communication. Each of these requires new CAD support to be used effectively.
Keywords :
carbon nanotubes; circuit CAD; integrated circuit design; integrated circuit interconnections; CAD support; carbon nanotube; interconnect technology; metal interconnect; on-chip communication; optical interconnection; three dimensional IC; Algorithm design and analysis; Carbon nanotubes; Integrated circuit interconnections; Integrated circuit technology; Optical design; Optical interconnections; Permission; Photonic integrated circuits; Proposals; Routing; 3D interconnect; Algorithms; Design; Nanotubes; On-chip optical; Performance;
Conference_Titel :
Design Automation Conference, 2007. DAC '07. 44th ACM/IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-59593-627-1
