Title :
Machine-Vision-Based Measurement of BGA Connector Solder Balls
Author_Institution :
Shanghai Inst. of Technol., Shanghai
fDate :
July 30 2007-Aug. 1 2007
Abstract :
This article presents the principle and application of a machine-vision-based method of measuring the quality of solder balls on BGA devices. The method first acquires two images of a BGA connector respectively with the same light source but different light angles, obtains from the two images the information on surfaces of solder balls and calculates the chief quality parameters of the solder balls in the end. The main algorithm measuring the solder balls is given in the article.
Keywords :
automatic optical inspection; ball grid arrays; computer vision; printed circuit manufacture; production engineering computing; quality control; BGA connector solder balls; BGA devices; PCB board; machine-vision-based quality measurement; packaging technique; Connectors; Contacts; Electronics packaging; Image sampling; Lead; Light sources; Machine vision; Production; Software measurement; Time measurement; machine vision; measurement algorithm; solder ball measurement;
Conference_Titel :
Software Engineering, Artificial Intelligence, Networking, and Parallel/Distributed Computing, 2007. SNPD 2007. Eighth ACIS International Conference on
Conference_Location :
Qingdao
Print_ISBN :
978-0-7695-2909-7
DOI :
10.1109/SNPD.2007.324
