Machine-Vision-Based Measurement of BGA Connector Solder Balls

Author

Jun, Gao

Author_Institution

Shanghai Inst. of Technol., Shanghai

Volume

2

fYear

2007

fDate

July 30 2007-Aug. 1 2007

Firstpage

177

Lastpage

180

Abstract

This article presents the principle and application of a machine-vision-based method of measuring the quality of solder balls on BGA devices. The method first acquires two images of a BGA connector respectively with the same light source but different light angles, obtains from the two images the information on surfaces of solder balls and calculates the chief quality parameters of the solder balls in the end. The main algorithm measuring the solder balls is given in the article.

Keywords

automatic optical inspection; ball grid arrays; computer vision; printed circuit manufacture; production engineering computing; quality control; BGA connector solder balls; BGA devices; PCB board; machine-vision-based quality measurement; packaging technique; Connectors; Contacts; Electronics packaging; Image sampling; Lead; Light sources; Machine vision; Production; Software measurement; Time measurement; machine vision; measurement algorithm; solder ball measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Software Engineering, Artificial Intelligence, Networking, and Parallel/Distributed Computing, 2007. SNPD 2007. Eighth ACIS International Conference on

Conference_Location

Qingdao

Print_ISBN

978-0-7695-2909-7

Type

conf

DOI

10.1109/SNPD.2007.324

Filename

4287673