• DocumentCode
    46707
  • Title

    The GaN-Based Light Emitting Diode Grown on Nanopattern Sapphire Substrate Prepared by Inductively Coupled Plasma Etching

  • Author

    Jyun-Hao Lin ; Shyh-Jer Huang ; Yan-Kuin Su ; Kai-Wen Huang

  • Author_Institution
    Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
  • Volume
    42
  • Issue
    12
  • fYear
    2014
  • fDate
    Dec. 2014
  • Firstpage
    3792
  • Lastpage
    3796
  • Abstract
    We applied nanoimprint lithography to fabricate nanopattern sapphire substrate. Because the imprint resin cannot endure the inductively coupled plasma bombardment, we use Ni metal to replace the resin as our etching mask. And then, we tuned the parameters to achieve a depth-enough nanopattern sapphire substrate (200-500-nm thick). Then, light emitting diode (LED) structures were grown and the quality was characterized by X-ray diffraction and photoluminescence. The LED tester and integrating sphere were used to analyze the device property. The results could demonstrate that the film quality was improved with increasing etching depth. And, the compressive strain was also released with increasing etching depth. In addition, increasing etching depth could not only improve internal quantum efficiency, but also improve light extraction efficiency. Thus, the external quantum efficiency was enhanced. These evidences demonstrated that nanopatterned sapphire with deeper depth certainly enhanced performance of LEDs.
  • Keywords
    III-V semiconductors; X-ray diffraction; compressive strength; gallium compounds; light emitting diodes; nanofabrication; nanolithography; nanopatterning; photoluminescence; semiconductor growth; sputter etching; wide band gap semiconductors; Al2O3; GaN; GaN-based light emitting diode; X-ray diffraction; compressive strain; depth-enough nanopattern sapphire substrate; inductively coupled plasma bombardment; inductively coupled plasma etching; internal quantum efficiency; nanoimprint lithography; nanopattern sapphire substrate; photoluminescence; size 200 nm to 500 nm; Etching; Gallium nitride; Iterative closest point algorithm; Light emitting diodes; Nickel; Resins; Substrates; Etching rate; GaN; inductively coupled plasma (ICP); selectivity;
  • fLanguage
    English
  • Journal_Title
    Plasma Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-3813
  • Type

    jour

  • DOI
    10.1109/TPS.2014.2346245
  • Filename
    6883225