• DocumentCode
    467436
  • Title

    Review: Fine Embossing of Novel Glasses for Photonic Integrated Circuits

  • Author

    Seddon, A.B. ; Furniss, D. ; Pan, W.J. ; Sewell, P. ; Loni, A. ; Zhang, Y. ; Benson, T.M.

  • Author_Institution
    Univ. of Nottingham, Nottingham
  • Volume
    2
  • fYear
    2007
  • fDate
    1-5 July 2007
  • Firstpage
    280
  • Lastpage
    283
  • Abstract
    Hot embossing of novel inorganic-compound glasses is a new fabrication technology for guided wave devices and circuitry. A patterned mould is pressed into the glass above its glass transition temperature (Tg) and replicated; cooling below Tg freezes-in the required pattern. The state-of-the-art is reviewed. Better than 0.1 mum-scale replication is shown for chalcogenide glasses and fabrication of a hot embossed monomode waveguide demonstrated.
  • Keywords
    embossing; inorganic compounds; integrated optics; moulding; optical fabrication; optical glass; optical waveguides; inorganic-compound glasses; mould; photonic integrated circuits; state-of-the-art; Embossing; Fiber nonlinear optics; Glass; Nonlinear optics; Optical refraction; Optical sensors; Optical variables control; Optical waveguides; Photonic integrated circuits; Silicon compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Transparent Optical Networks, 2007. ICTON '07. 9th International Conference on
  • Conference_Location
    Rome
  • Print_ISBN
    1-4244-1249-8
  • Electronic_ISBN
    1-4244-1249-8
  • Type

    conf

  • DOI
    10.1109/ICTON.2007.4296204
  • Filename
    4296204
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=467436