DocumentCode
467798
Title
Prediction of Laser Cutting Qualities for BGA Strip by Artificial Neural Networks
Author
Li, Chen-Hao ; Tsai, Ming-Jong ; Chen, Cheng-Che ; Li, Chun-Hao
Author_Institution
Nat. Taiwan Univ. of Sci. & Technol., Taipei
Volume
3
fYear
2007
fDate
19-22 Aug. 2007
Firstpage
1796
Lastpage
1801
Abstract
This paper reports a new laser cutting technology for cut ting a BGA (ball grid array) strip. Due to the cutting path including two different materials, i.e. epoxy and copper substrate, so we adopt two cutting processes for epoxy and copper substrate, respectively. Then we utilize artificial neural networks (ANN) to build two predictive models including epoxy and substrate for laser cutting qualities of a strip BGA. Two ANN models use the back-propagation (BP) with Levenberg-Marquardt (LM) algorithm. From the experimental results, the average predicted errors of epoxy for training and testing processes are 0.496% and 1.786%, respectively, and the errors for substrate are 0.797% and 1.532%, respectively. The results show that two ANN models have the predictive ability to estimate three laser cutting qualities for BGA strip accurately. The ANN applied to this paper is very successfully and may give guides in the predictions of cutting BGA strip and is expected to be useful for laser applications in other industry fields.
Keywords
backpropagation; ball grid arrays; copper; laser beam cutting; neural nets; production engineering computing; strips; substrates; Cu; Levenberg-Marquardt algorithm; artificial neural network; backpropagation; ball grid array strip; epoxy; heat affected zone; laser cutting; substrate; Artificial neural networks; Copper; Electronics packaging; Laser applications; Laser beam cutting; Laser modes; Optical materials; Predictive models; Strips; Testing; Artificial Neural network (ANN); Ball Grid Array (BGA) strip; Heat Affected Zone(HAZ); Levenberg-Marquardt (LM); back-propagation (BP);
fLanguage
English
Publisher
ieee
Conference_Titel
Machine Learning and Cybernetics, 2007 International Conference on
Conference_Location
Hong Kong
Print_ISBN
978-1-4244-0973-0
Electronic_ISBN
978-1-4244-0973-0
Type
conf
DOI
10.1109/ICMLC.2007.4370439
Filename
4370439
Link To Document