• DocumentCode
    46785
  • Title

    Investigations on Line-Edge Roughness (LER) and Line-Width Roughness (LWR) in Nanoscale CMOS Technology: Part I–Modeling and Simulation Method

  • Author

    Xiaobo Jiang ; Runsheng Wang ; Tao Yu ; Jiang Chen ; Ru Huang

  • Author_Institution
    Inst. of Microelectron., Peking Univ., Beijing, China
  • Volume
    60
  • Issue
    11
  • fYear
    2013
  • fDate
    Nov. 2013
  • Firstpage
    3669
  • Lastpage
    3675
  • Abstract
    In this paper, the correlation between line-edge roughness (LER) and line-width roughness (LWR) is investigated. Based on the characterization methodology of auto-correlation functions (ACF), a new theoretical model of LWR is proposed, which indicates that the LWR ACF is composed of two parts: one involves LER information; the other involves the cross-correlation of the two edges. Additional characteristic parameters for LER/LWR are proposed to represent the missing cross-correlation information in conventional approaches of LER/LWR description, other than LER/LWR amplitude and auto-correlation length. An improved simulation method for correlated LERs is also proposed, which can provide helpful guidelines for the characterization, modeling, and the optimization of LER/LWR in nanoscale CMOS technology. The experimental results and device simulation results are discussed in detail in the part II of this paper.
  • Keywords
    CMOS integrated circuits; circuit simulation; integrated circuit modelling; nanoelectronics; LER-LWR amplitude; autocorrelation function characterization methodology; autocorrelation length; circuit simulation method; device simulation; line-edge roughness; line-width roughness; nanoscale CMOS technology; CMOS integrated circuits; CMOS technology; Fourier transforms; Logic gates; Nanoscale devices; Auto-correlation function; cross-correlation; line-edge-roughness (LER); line-width-roughness (LWR); modeling; variability;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2013.2283518
  • Filename
    6627942