Title :
The Effect of Structural Parameters on Electrical Resitance of Microcontact Connections in Integrated Circuits
Author :
Smerklo, Lubomyr ; Dyachok, Dmytro ; Hladun, Mykhaylo
Author_Institution :
Lviv Radio Eng. Res. Inst., Lviv
fDate :
Feb. 28 2006-March 4 2006
Abstract :
The mathematical equations for analysis of dependence of electric resistance of microcontact connection (MCC) on its dimension and intermediate resistance are considered. The computation software is designed. It is established that in proposed model the width and thickness of film conductor layer do not influence on MCC resistance and change of wire diameter impacts greatly on MCC resistance. For small MCC dimension its resistance is determined by intermediate contact resistance.
Keywords :
contact resistance; integrated circuit interconnections; integrated circuits; computation software; contact resistance; electric resistance; electrical resitance; integrated circuits; mathematical equations; microcontact connections; structural parameters; Conductive films; Conductivity; Contact resistance; Electric resistance; Equations; Mathematical model; Software design; Structural engineering; Welding; Wire; contact resistance; microcontact connections;
Conference_Titel :
Modern Problems of Radio Engineering, Telecommunications, and Computer Science, 2006. TCSET 2006. International Conference
Conference_Location :
Lviv-Slavsko
Print_ISBN :
966-553-507-2
DOI :
10.1109/TCSET.2006.4404657
