DocumentCode
468875
Title
SiGe BiCMOS Technology with 3.0 ps Gate Delay
Author
Riicker, H. ; Heinemann, B. ; Barth, R. ; Bauer, J. ; Blum, K. ; Bolze, D. ; Drews, J. ; Fischer, G.G. ; Fox, A. ; Fursenko, O. ; Grabolla, T. ; Haak, U. ; Höppner, W. ; Knoll, D. ; Köpke, K. ; Kuck, B. ; Mai, A. ; Marschmeyer, S. ; Morgenstern, T. ; Rich
Author_Institution
IHP, Frankfurt
fYear
2007
fDate
10-12 Dec. 2007
Firstpage
651
Lastpage
654
Abstract
This work reports on a 130 nm BiCMOS technology with high-speed SiGe:C HBTs featuring a transit frequency of 255 GHz and a maximum oscillation frequency of 315 GHz at an emitter area of 0.17 x 0.53 mum2. A minimum gate delay of 3.0 ps was achieved for CML ring oscillators. Breakdown voltages of the HBTs are measured to be BVCEO=1.8 V, BVCBO=5.6 V, andBVEBO=1.9 V.
Keywords
BiCMOS integrated circuits; delays; silicon compounds; BiCMOS technology; HBT; gate delay; silicon; BiCMOS integrated circuits; CMOS process; CMOS technology; Delay; Frequency; Germanium silicon alloys; Heterojunction bipolar transistors; Millimeter wave technology; Ring oscillators; Silicon germanium;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2007. IEDM 2007. IEEE International
Conference_Location
Washington, DC
Print_ISBN
978-1-4244-1507-6
Electronic_ISBN
978-1-4244-1508-3
Type
conf
DOI
10.1109/IEDM.2007.4419028
Filename
4419028
Link To Document