Title :
Mechanical Behaviour of Grains in SnAgCu Solder Joints
Author :
Gong, Jicheng ; Liu, Changging ; Conway, Paul P. ; Silberschmidt, Vadim V.
Author_Institution :
Loughborough Univ., Loughborough
Abstract :
A collection of slides from the authors conference presentation is given.
Keywords :
copper alloys; crystal microstructure; flip-chip devices; mechanical properties; shearing; silver alloys; solders; SnAgCu; flip chip electronics; grains; mechanical behaviour; microstructure; shearing test; single crystal; solder joints; Manufacturing; Soldering; Tensile stress;
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon
Print_ISBN :
978-1-4244-0834-4
Electronic_ISBN :
978-1-4244-0834-4
DOI :
10.1109/EMAP.2006.4430595
