• DocumentCode
    469372
  • Title

    The Evolution of CPU Packaging Technology and Future Challenges

  • Author

    Oh, Boon Howe ; Lee, Eng Kwong ; Loo, Howe Yin ; Oh, Poh Tat

  • Author_Institution
    Intel Microelectron. Sdn Bhd, Penang
  • fYear
    2006
  • fDate
    11-14 Dec. 2006
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    The demand for high performance and robustness drive CPU to evolve from MHz to GHz and from single core to multi-core packages. This paper describes the changes in CPU packaging technology and its evolution in the past three decades.
  • Keywords
    electronics packaging; microprocessor chips; CPU packaging technology; microprocessor technology; multicore packages; Ceramics; Electronics industry; Electronics packaging; Microelectronics; Microprocessors; Pins; Protection; Robustness; Semiconductor device packaging; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
  • Conference_Location
    Kowloon
  • Print_ISBN
    978-1-4244-0834-4
  • Electronic_ISBN
    978-1-4244-0834-4
  • Type

    conf

  • DOI
    10.1109/EMAP.2006.4430605
  • Filename
    4430605
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=469372