• DocumentCode
    470019
  • Title

    The Multi-Motion-Overlap Strategy to Minimize Time between Continuous Exposure Scans for Wafer Stage

  • Author

    Pan, Hai-Hong ; Li, Xiao-Qing ; Zhou, Yun-Fei

  • Author_Institution
    Huazhong Univ. of Sci. & Technol., Wuhan
  • fYear
    2007
  • fDate
    14-17 Aug. 2007
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    During the exposure process, the transitional time between continuous scans does not produce production efficiency in which no scanning occurs. This inefficiency increases the total time to manufacture a chip on a wafer and limits the productivity of wafer in a production process. To optimize the transitional step time, we investigated the motion trajectory planning along the scanning direction for wafer stage during the exposure scanning process and introduced multi-motion-overlap strategy (MMO). The switch points of the step-move and scan-move were obtained by the theoretical analysis with MMO strategy, which did not violate the constant velocity phase and the limitations of acceleration and velocity along trajectories. The simulation results of the total time consumed between two continuous scans under the four different exposure field sizes are following: the MMO strategy enables the total time reduction 4.82%, 2.62%, 3.06% and 3.96%, compared with the conventional motion planning method, and 2.58%, 0.76%, 1.63% and 2.92% compared with literature method, respectively. The above theoretical analysis and simulation results illuminate that the multi-motion-overlap strategy can effectively minimize the transitional step time between continuous exposure scans and further to increase the wafer fabricating productivity.
  • Keywords
    integrated circuit manufacture; lithography; productivity; wafer level packaging; chip-on-wafer manufacture; continuous exposure scans; motion trajectory planning; multimotion-overlap strategy; step-and-scan lithographic method; transitional step time minimization; wafer productivity; wafer stage; Acceleration; Continuous production; Costs; Lenses; Manufacturing processes; Productivity; Semiconductor device manufacture; Strategic planning; Switches; Telephony;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-1392-8
  • Electronic_ISBN
    978-1-4244-1392-8
  • Type

    conf

  • DOI
    10.1109/ICEPT.2007.4441474
  • Filename
    4441474