Comparison between ANSYS and CATIA Simulation Capability in Simulating Round Shape Diaphragm of MEMS Piezoresistive Pressure Sensor

Author

Zaiazmin, Y.N. ; Azid, I.A.

Author_Institution

Kolej Univ. Kejuruteraan Utara Malaysia, Perlis

fYear

2007

fDate

8-10 Nov. 2007

Firstpage

191

Lastpage

195

Abstract

This paper presents a comparative study of MEMS piezoresistive pressure sensor simulation using two different software of ANSYS and CATIA respectively. It is aimed to investigate the feasibility of utilizing CATIA software in simulating microstructure such as MEMS device as an alternative to ANSYS simulation software. CATIA software is chosen because it is usually used in the automotive industries worldwide. Two types of diaphragm design were used in this simulation which is supported rim and without supported rim. Tetrahedral meshing with size of 0.05 mm was used in both ANSYS and CATIA simulation. Analysis of results is then made on the magnitude of x-component and Von Misses stresses on the surface of the diaphragm and also the diaphragm deflection. Based on the findings, it is concluded that CATIA software can also be used as an alternative in modeling and simulating a microstructure such as MEMS device.

Keywords

computerised instrumentation; digital simulation; micromechanical devices; piezoresistive devices; pressure sensors; ANSYS simulation; CATIA simulation; MEMS piezoresistive pressure sensor; Von Misses stresses; automotive industries; diaphragm deflection; diaphragm design; round shape diaphragm simulation; tetrahedral meshing; Automotive engineering; Computer industry; Consumer electronics; Machinery production industries; Manufacturing industries; Microelectromechanical devices; Micromechanical devices; Piezoresistance; Shape; Stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing and Technology, 31st International Conference on

Conference_Location

Petaling Jaya

ISSN

1089-8190

Print_ISBN

978-1-4244-0730-9

Electronic_ISBN

1089-8190

Type

conf

DOI

10.1109/IEMT.2006.4456454

Filename

4456454