• DocumentCode
    471447
  • Title

    Transcutaneous Battery Recharging By Volume Conduction and its Circuit Modeling

  • Author

    Tang, Zhide ; Sclabassi, Robert J. ; Sun, Caixin ; Hackworth, Steven A. ; Zhao, Jun ; Cui, Xinyan T. ; Sun, Mingui

  • Author_Institution
    Chongqing Univ.
  • fYear
    2006
  • fDate
    Aug. 30 2006-Sept. 3 2006
  • Firstpage
    644
  • Lastpage
    647
  • Abstract
    Many implantable devices require large capacity batteries implanted in the body. Transcutaneous battery recharging can effectively maintain the longevity of these implants. Based on this consideration we have developed a transcutaneous battery recharging circuit unit which takes advantages of skin volume conduction. This unit is able to pass 2.8 mA from the outside to the inside of pig skin with a current transmitting efficiency of 27%. Theoretical analysis and experiments have validated that this battery recharging technology is an effective approach. In this research we have constructed an x-type equivalent circuit model of skin volume conduction for battery recharging. The parameters of the x-type equivalent circuit can be easily measured and used to evaluate the battery charging system characteristics, such as the rechargeable prerequisite and the current transmitting efficiency limitation. We have analyzed the transcutaneous current transmitting efficiency by applying the x-type equivalent circuit model and discussed approaches for enhancing current transmitting efficiency
  • Keywords
    prosthetic power supplies; skin; 2.8 mA; battery charging system characteristics; battery recharging technology; current transmitting efficiency; implantable devices; skin volume conduction; transcutaneous battery recharging circuit unit; x-type equivalent circuit model; Batteries; Cities and towns; Electrodes; Equivalent circuits; Humans; Impedance; Implants; Power supplies; Skin; Sun;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
  • Conference_Location
    New York, NY
  • ISSN
    1557-170X
  • Print_ISBN
    1-4244-0032-5
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2006.259702
  • Filename
    4461833