Title :
Light-addressable planar electrode with hydrogenated amorphous silicon and low-conductive passivation layer for stimulation of cultured neurons
Author :
Suzurikawa, Jun ; Takahashi, Hirokazu ; Takayama, Yuzo ; Warisawa, Shin Ichi ; Mitsuishi, Mamoru ; Nakao, Masayuki ; Jimbo, Yasuhiko
Author_Institution :
Dept. of Mechano-Informatics, Tokyo Univ.
fDate :
Aug. 30 2006-Sept. 3 2006
Abstract :
Conventional multielectrode arrays (MEAs) cannot always access desired neurons due to low electrode density and small number of electrode. To overcome this problem, we propose a light-addressable planar electrode on a glass substrate. The electrode has a 3-layer structure, namely a transparent SnO2 layer, an hydrogenated amorphous silicon (a-Si:H) layer, and a passivation layer. Illumination to the a-Si:H layer increases the conductivity of a-Si:H and creates a virtual electrode at the surface of the illuminated site. In the present study, we developed a low-conductive zinc antimonate-dispersed epoxy layer. This layer could successfully prevent penetration of culture medium and thus deterioration of a-Si:H layer. A fluo-4 calcium imaging demonstrated that, when the whole area of electrode was illuminated, negative-monophasic voltage-controlled pulses could also successfully activate neurons cultured on the electrode. Moreover, the focused illumination to the electrode resulted in the selective activation of neurons around the illuminated area
Keywords :
amorphous semiconductors; biomedical electrodes; neurophysiology; tin compounds; zinc compounds; Si; SnO2; ZnSb2O6; cultured neuron stimulation; fluo-4 calcium imaging; glass substrate; hydrogenated amorphous silicon; light-addressable planar electrode; low-conductive passivation layer; negative-monophasic voltage-controlled pulse; zinc antimonate-dispersed epoxy layer; Amorphous silicon; Calcium; Conductivity; Electrodes; Glass; Lighting; Neurons; Passivation; Voltage; Zinc;
Conference_Titel :
Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
Conference_Location :
New York, NY
Print_ISBN :
1-4244-0032-5
Electronic_ISBN :
1557-170X
DOI :
10.1109/IEMBS.2006.259828