DocumentCode
471726
Title
PACS through Web Compatible with DICOM Standard and WADO Service: Advantages and Implementation
Author
Koutelakis, George V. ; Lymperopoulos, Dimitrios K.
fYear
2006
fDate
Aug. 30 2006-Sept. 3 2006
Firstpage
2601
Lastpage
2605
Abstract
All users of informatics applications need rapid and reliable access to the kind of information that they are interested in. Web technology provides these capabilities. DICOM standard committees recognized the necessity of a Web medical standard. They specified WADO (Web access to DICOM object) service, so that system interaction takes place through Web, in a standarized way, allowing interoperability and proper information management inside PACS. The advantages of a Web PACS comparatively with a compatible PACS are multiple and they are detected in different fields of functionality. The authors have run a project of a WADO compatible Web PACS development. A Web portal platform with enhanced security has been implemented. Over it, DICOM applications have been developed. JavaServer Pages (JSP) technology is mainly used to satisfy design specifications and dynamic data exchanges. Furthermore, Java applets have been developed and introduced in the whole project to serve specific demands. Evaluation results confirmed our considerations about the improvement of DICOM services, when they are provided through Web
Keywords
Java; PACS; Web services; electronic data interchange; open systems; portals; DICOM object; DICOM standard; Java applets; JavaServer Pages technology; WADO; Web PACS; Web access; Web medical standard; Web portal platform; Web technology; data exchanges; informatics applications; information management; interoperability; system interaction; Access protocols; Application software; Biomedical imaging; DICOM; Data security; Information security; Java; Picture archiving and communication systems; Protection; Workstations;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
Conference_Location
New York, NY
ISSN
1557-170X
Print_ISBN
1-4244-0032-5
Electronic_ISBN
1557-170X
Type
conf
DOI
10.1109/IEMBS.2006.260761
Filename
4462329
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