• DocumentCode
    47175
  • Title

    Impact of Recipe Restrictions on Photolithography Toolsets in an ASIC Fabrication Environment

  • Author

    Kabak, Kamil Erkan ; Heavey, Cathal ; Corbett, V. ; Byrne, P.J.

  • Author_Institution
    Dept. of Ind. Eng., Beykent Univ., Istanbul, Turkey
  • Volume
    26
  • Issue
    1
  • fYear
    2013
  • fDate
    Feb. 2013
  • Firstpage
    53
  • Lastpage
    68
  • Abstract
    In this paper, a detailed discrete event simulation model is used to better understand the effects of recipe constraints resulting from process restrictions and tool capabilities on overall average cycle time performance of a photolithography area and on average cycle times of individual mask layers. The study is motivated by the industry, in which engineers have to frequently make decisions on tool qualifications and recipe coverage. An experimental procedure is developed and implemented to show the impact of different levels of tool paths on photolithography toolsets. The simulation results show that increasing the number of tool paths decreases the overall average photolithography cycle time for particular wafer loading levels. Also, as start volumes increase, toolset utilizations increase and the impact of single-path tools on average cycle times increases. Immature processes and low-use processes tend to have more single paths and thus suffer higher average cycle times accordingly. Furthermore, it is reported that average cycle time decreases significantly under multiple process environments due to the lower impact of single paths.
  • Keywords
    application specific integrated circuits; masks; photolithography; ASIC fabrication environment; discrete event simulation model; mask layer; particular wafer loading level; photolithography cycle time; photolithography toolset; recipe constraint; recipe coverage; recipe restriction; tool path; tool qualification; Application specific integrated circuits; Availability; Dispatching; Educational institutions; Fabrication; Lithography; Semiconductor device modeling; ASIC; photolithography process; recipe constraints; tool paths;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2012.2220572
  • Filename
    6311482