DocumentCode
471855
Title
The role of flexible polymer interconnects in chronic tissue response induced by intracortical microelectrodes - a modeling and an in vivo study
Author
Subbaroyan, Jeyakumar ; Kipke, Daryl R.
Author_Institution
Biomed. Eng. Dept., Michigan Univ., Ann Arbor, MI
fYear
2006
fDate
Aug. 30 2006-Sept. 3 2006
Firstpage
3588
Lastpage
3591
Abstract
Chronic tissue response induced by tethering is one of the major causes for implant failure in intracortical microelectrodes. In this study, we had explored the hypothesis that flexible interconnects could provide strain relief against forces of "micromotion" and hence could result in maintaining a healthy tissue surrounding the implant. Finite element modeling results indicated that flexible interconnects, namely polyimide (E=2 GPa) and polydimethylsiloxane (PDMS, E=6 MPa), reduced the interfacial strain by 66% and two orders of magnitude, respectively. Quantitative immunohistochemistry results indicated that significant neuronal loss occurred up to 60 mum from the implant interface. This was strongly correlated to both glial fibrillary acidic protein (GFAP) expression and simulated strain as a function of distance away from the implant
Keywords
biochemistry; biological tissues; biomedical electrodes; biomedical materials; cellular biophysics; finite element analysis; microelectrodes; molecular biophysics; neurophysiology; physiological models; polymers; prosthetics; proteins; chronic tissue response; finite element modeling; flexible polymer interconnects; glial fibrillary acidic protein expression; implant failure; in vivo study; interfacial strain; intracortical microelectrodes; micromotion; neuronal cell count; neuronal loss; polydimethylsiloxane; polyimide; quantitative immunohistochemistry; Assembly; Brain modeling; Cables; Capacitive sensors; Finite element methods; Implants; In vivo; Microelectrodes; Polymers; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
Conference_Location
New York, NY
ISSN
1557-170X
Print_ISBN
1-4244-0032-5
Electronic_ISBN
1557-170X
Type
conf
DOI
10.1109/IEMBS.2006.260517
Filename
4462573
Link To Document