Title :
A Blind Calibration Scheme Exploiting Mutual Calibration Relationships for a Dense Mobile Sensor Network
Author :
Byung-Tak Lee ; Seung-Chul Son ; Kyungran Kang
Author_Institution :
Electron. & Telecommun. Res. Inst., Daejeon, South Korea
Abstract :
In sensor-based measurement systems, the sensor calibrations are crucial to obtain the correct measured values. In this paper, we propose a new blind calibration scheme for a massive mobile sensor network. The mutual calibration relationships between colocated sensors are utilized in a densely deployed sensor network. We model the calibration relationships in a linear algebraic model, and derive an equivalent Laplacian matrix. By just solving the Laplacian linear equation, we can determine how much each sensor has to be calibrated. The proposed calibration scheme is explained as a generalized extension of the simple mean model scheme to the mobile sensor network. Theoretical analysis and simulation results show that the proposed linear algebraic model improves the accuracy of the simple mean model by nearly σdrift2/σnoise2 times at maximum, in terms of mean square error, where usually σdrift ≫ σnoise. In addition, we show the feasibility of our scheme on human movements, by applying the scheme to the Levy-walk model in the simulation. The most important advantages of our scheme are that the calibration model is straightforward and that the solution is simply obtained with a matrix inversion.
Keywords :
Laplace equations; calibration; matrix inversion; mean square error methods; sensors; Laplacian linear equation; Levy-walk model; blind calibration scheme; colocated sensor utilization; equivalent Laplacian matrix inversion; linear algebraic model; mean square error; mobile sensor network; mutual calibration relationship; sensor-based measurement system; Calibration; Equations; Intelligent sensors; Laplace equations; Mathematical model; Noise; Laplacian matrix; Levy-walk; Sensor calibration; blind calibration; distributed sensor network; network graph model;
Journal_Title :
Sensors Journal, IEEE
DOI :
10.1109/JSEN.2013.2297714