LPCVD Tungsten Silicide with Titanium Underlayer

Author

Joshi, Rajiv V. ; Krusin-Elbaum, L. ; Wetzel, J.T. ; Herd, S.R. ; Brodsky, S. ; Karasinski, J.

Author_Institution

IBM T. J. Watson Research Center Yorktown Heights, New York 10598

fYear

1986

fDate

28-30 May 1986

Firstpage

Lastpage

Keywords

Adhesives; Annealing; Conductivity; Mass spectroscopy; Metallization; Silicides; Temperature; Titanium; Tungsten; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Technology, 1986. Digest of Technical Papers. Symposium on

Conference_Location

San Diego, CA, USA

Type

Filename

4480366

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