DocumentCode :
472777
Title :
The Evaluation of a Single-Step Lift-off Process Using the Method of Response Surface Analysis
Author :
Hamel, C.J.
Author_Institution :
IBM General Technology Division Essex Junction, Vermont 05452
fYear :
1981
fDate :
9-11 Sept. 1981
Firstpage :
10
Lastpage :
11
Keywords :
Fabrication; Metallization; Resists; Response surface methodology; Semiconductor films; Size measurement; Solvents; Technological innovation; Temperature sensors; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, 1981. Digest of Technical Papers. Symposium on
Conference_Location :
Maui, HI, USA
Type :
conf
Filename :
4480500
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=472777
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