DocumentCode :
472786
Title :
1 μm Mo Gate MOS Technology
Author :
Fukumoto, M. ; Inoue, K. ; Ogawa, S. ; Okada, S. ; Kugimiya, K.
Author_Institution :
Semiconductor Research Laboratoty Matsushita Electric Industrial Company, Ltd. Moriguchi, Osaka 570, Japan
fYear :
1981
fDate :
9-11 Sept. 1981
Firstpage :
28
Lastpage :
29
Abstract :
A process technology for the high performance 1 μm Mo gate NMOS devices with MNOS and Si3N4+CVD SiO2 passivation structure has been demonstrated in this paper. The features of this technology are summarized as follow: 1) Contamination by mobile ions is blocked by a double-layer gate insulator and double-layer passivation of 20-nm Si3N4 film. MOSFET with little fluctuation in electrical characteristics is fabricated. 2) There arises no limitation to the process flexibility. 3) An inverter stage in a ring oscillator is switched as fast as 150 ps with less than 14 fJ power-delay product. At smaller VDD, even faster operations are realized. This 1 μm Mo gate process technology will allow high-speed and high-density VLSIs.
Keywords :
Contamination; Electric variables; Fluctuations; Insulation; Inverters; MOS devices; MOSFET circuits; Passivation; Power MOSFET; Semiconductor films;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, 1981. Digest of Technical Papers. Symposium on
Conference_Location :
Maui, HI, USA
Type :
conf
Filename :
4480509
Link To Document :
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