• DocumentCode
    472786
  • Title

    1 μm Mo Gate MOS Technology

  • Author

    Fukumoto, M. ; Inoue, K. ; Ogawa, S. ; Okada, S. ; Kugimiya, K.

  • Author_Institution
    Semiconductor Research Laboratoty Matsushita Electric Industrial Company, Ltd. Moriguchi, Osaka 570, Japan
  • fYear
    1981
  • fDate
    9-11 Sept. 1981
  • Firstpage
    28
  • Lastpage
    29
  • Abstract
    A process technology for the high performance 1 μm Mo gate NMOS devices with MNOS and Si3N4+CVD SiO2 passivation structure has been demonstrated in this paper. The features of this technology are summarized as follow: 1) Contamination by mobile ions is blocked by a double-layer gate insulator and double-layer passivation of 20-nm Si3N4 film. MOSFET with little fluctuation in electrical characteristics is fabricated. 2) There arises no limitation to the process flexibility. 3) An inverter stage in a ring oscillator is switched as fast as 150 ps with less than 14 fJ power-delay product. At smaller VDD, even faster operations are realized. This 1 μm Mo gate process technology will allow high-speed and high-density VLSIs.
  • Keywords
    Contamination; Electric variables; Fluctuations; Insulation; Inverters; MOS devices; MOSFET circuits; Passivation; Power MOSFET; Semiconductor films;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 1981. Digest of Technical Papers. Symposium on
  • Conference_Location
    Maui, HI, USA
  • Type

    conf

  • Filename
    4480509