DocumentCode
472809
Title
Thin Gate Insulators for VLSI
Author
Ito, T. ; Nakamura, T. ; Ishikawa, H.
Author_Institution
Fujitsu Laboratories Ltd. 1015 Kamikodanaka, Nakahara, Kawasaki, Japan 211
fYear
1981
fDate
9-11 Sept. 1981
Firstpage
72
Lastpage
73
Abstract
Thin gate SiO2 films less than 200A often suffer from various deteriorating effects throughout developmental VLSI processes. Thermal nitridation of SiO2 has improved MOS characteristics with such thin SiO2 films producing surface protective layers against impurity penetration and good interfacial properties. This fact verifies that the most promising candidate for a very thin gate insulator is a thermally grown silicon nitride film on a silicon substrate. The experimental results have shown significant benefits to future VLSI devices.
Keywords
Dielectric thin films; Dielectrics and electrical insulation; Electric breakdown; Electrons; Impurities; Plasma temperature; Production; Semiconductor films; Silicon; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 1981. Digest of Technical Papers. Symposium on
Conference_Location
Maui, HI, USA
Type
conf
Filename
4480532
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