• DocumentCode
    472809
  • Title

    Thin Gate Insulators for VLSI

  • Author

    Ito, T. ; Nakamura, T. ; Ishikawa, H.

  • Author_Institution
    Fujitsu Laboratories Ltd. 1015 Kamikodanaka, Nakahara, Kawasaki, Japan 211
  • fYear
    1981
  • fDate
    9-11 Sept. 1981
  • Firstpage
    72
  • Lastpage
    73
  • Abstract
    Thin gate SiO2 films less than 200A often suffer from various deteriorating effects throughout developmental VLSI processes. Thermal nitridation of SiO2 has improved MOS characteristics with such thin SiO2 films producing surface protective layers against impurity penetration and good interfacial properties. This fact verifies that the most promising candidate for a very thin gate insulator is a thermally grown silicon nitride film on a silicon substrate. The experimental results have shown significant benefits to future VLSI devices.
  • Keywords
    Dielectric thin films; Dielectrics and electrical insulation; Electric breakdown; Electrons; Impurities; Plasma temperature; Production; Semiconductor films; Silicon; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 1981. Digest of Technical Papers. Symposium on
  • Conference_Location
    Maui, HI, USA
  • Type

    conf

  • Filename
    4480532