DocumentCode
472855
Title
Wafer Design
Author
Takasu, Shin.
Author_Institution
Toshiba Research and Development Center Kawasaki 210 Japan
fYear
1982
fDate
1-3 Sept. 1982
Firstpage
80
Lastpage
81
Keywords
Gettering; Heat treatment; History; Large scale integration; Manufacturing processes; Oxygen; Silicon; Surface treatment; Temperature; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 1982. Digest of Technical Papers. Symposium on
Conference_Location
Oiso, Japan
Type
conf
Filename
4480586
Link To Document