Title :
Electron Beam Testing of VLSI Packaging Substrates
Author :
Chang, T.H.P. ; Hohn, F.J. ; Kern, D.P. ; Coane, P.J. ; Bruenger, W.
Author_Institution :
I.B.M. Thomas J. Watson Research Center Yorktown Heights, New York 10598
Keywords :
Ceramics; Electron beams; Integrated circuit interconnections; Packaging; Performance evaluation; Printed circuits; Surface charging; Testing; Very large scale integration; Voltage;
Conference_Titel :
VLSI Technology, 1982. Digest of Technical Papers. Symposium on
Conference_Location :
Oiso, Japan
