DocumentCode
472862
Title
Electron Beam Testing of VLSI Packaging Substrates
Author
Chang, T.H.P. ; Hohn, F.J. ; Kern, D.P. ; Coane, P.J. ; Bruenger, W.
Author_Institution
I.B.M. Thomas J. Watson Research Center Yorktown Heights, New York 10598
fYear
1982
fDate
1-3 Sept. 1982
Firstpage
94
Lastpage
95
Keywords
Ceramics; Electron beams; Integrated circuit interconnections; Packaging; Performance evaluation; Printed circuits; Surface charging; Testing; Very large scale integration; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 1982. Digest of Technical Papers. Symposium on
Conference_Location
Oiso, Japan
Type
conf
Filename
4480593
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