DocumentCode
472907
Title
Plasma Etch in Via and Tri-Layer Resist
Author
Lin, Jung ; O´toole, Michael M.
Author_Institution
Hewlett-Packard Labs Palo Alto, California 94304
fYear
1983
fDate
13-15 Sept. 1983
Firstpage
82
Lastpage
83
Keywords
Anisotropic magnetoresistance; Dielectric substrates; Helium; Metallization; Optical films; Plasma applications; Reflection; Resists; Sputter etching; Sputtering;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 1983. Digest of Technical Papers. Symposium on
Conference_Location
Maui, HI, USA
Print_ISBN
4-930813-05-0
Type
conf
Filename
4480647
Link To Document