DocumentCode
472948
Title
Disilane Photo-Epitaxy for VLSI
Author
Yamazaki, T. ; Ito, T. ; Ishikawa, H.
Author_Institution
Fujitsu Laboratories Ltd. 1677 Ono, Atsugi, Japan 243-01
fYear
1984
fDate
10-12 Sept. 1984
Firstpage
56
Lastpage
57
Abstract
The low-temperature photo-epitaxy technique has been developed using Si2H6 source gas. The Si2H6 gas is directly dissociated under UV light irradiation resulting in increase of growth rate. The epitaxial growth has been possible at a substrate temperature of 630°C. The nearly abrupt impurity profile is obtained which is advantageous for production of VLSI devices with small dimensions.
Keywords
Epitaxial growth; Epitaxial layers; Hydrogen; Impurities; Indium tin oxide; Inductors; Silicon; Substrates; Temperature dependence; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 1984. Digest of Technical Papers. Symposium on
Conference_Location
San Diego, CA, USA
Print_ISBN
4-930813-08-5
Type
conf
Filename
4480697
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