• DocumentCode
    47325
  • Title

    Superior Electrostrictive Strain Behavior of Antiferroelectric ({\\rm Pb}, {\\rm La})({\\rm Zr}, {\\rm Ti}){\\rm O}_{3} Thick Film Microcantilevers for MEMS Device Applicati

  • Author

    Xiujian Chou ; Xinfeng Guan ; Yongbo Lv ; Wenping Geng ; Jun Liu ; Chenyang Xue ; Wendong Zhang

  • Author_Institution
    Key Lab. of Instrum. Sci. & Dynamic Meas., North Univ. of China, Taiyuan, China
  • Volume
    34
  • Issue
    9
  • fYear
    2013
  • fDate
    Sept. 2013
  • Firstpage
    1187
  • Lastpage
    1189
  • Abstract
    The microcantilevers based on the antiferroelectric (AFE) (Pb0.97La0.02)(Zr0.95Ti0.05)O3 (PLZT) thick films were fabricated by bulk silicon micromachining process. The conspicuous electrostrictive strain properties with phase transition of the AFE PLZT films induced by electric field were investigated. The resonant vibration velocity and tip deflection on a 650- μm-long cantilever were up to 6767 mm/s and 45.7 μm, under the square wave excitation with the voltage of 40 V, matched to the AFE-ferroelectric phase transition electric field of 210 kV/cm. The ratio of induced tip displacement and cantilever length per unit voltage [d(δ)/L/dV] was proposed to show the mutation response ability. In addition, the new AFE PLZT microcantilevers exhibited superior value of 10.77/kV, further higher than the traditional ones. Extensive application requirements for microdevices would be met in various fields of microelectromechanical systems.
  • Keywords
    antiferroelectric materials; cantilevers; electrostriction; ferroelectric devices; ferroelectric transitions; lanthanum compounds; lead compounds; micromachining; micromechanical devices; thick film devices; AFE PLZT films; AFE PLZT microcantilevers; AFE-ferroelectric phase transition electric field; MEMS device applications; PLZT; PLZT thick films; antiferroelectric thick film microcantilevers; bulk silicon micromachining process; cantilever length; conspicuous electrostrictive strain property; electrostrictive strain behavior; induced tip displacement; microdevices; microelectromechanical systems; mutation response ability; resonant vibration velocity; size 45.7 mum; size 650 mum; square wave excitation; tip deflection; voltage 40 V; Micromachining; Micromechanical devices; Resonant frequency; Silicon; Strain; Switches; Vibrations; Antiferroelectric thick film; electrostrictive strain; micro-cantilever; phase transition; tip deflection;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2013.2272211
  • Filename
    6562778