DocumentCode :
47325
Title :
Superior Electrostrictive Strain Behavior of Antiferroelectric ({\\rm Pb}, {\\rm La})({\\rm Zr}, {\\rm Ti}){\\rm O}_{3} Thick Film Microcantilevers for MEMS Device Applicati
Author :
Xiujian Chou ; Xinfeng Guan ; Yongbo Lv ; Wenping Geng ; Jun Liu ; Chenyang Xue ; Wendong Zhang
Author_Institution :
Key Lab. of Instrum. Sci. & Dynamic Meas., North Univ. of China, Taiyuan, China
Volume :
34
Issue :
9
fYear :
2013
fDate :
Sept. 2013
Firstpage :
1187
Lastpage :
1189
Abstract :
The microcantilevers based on the antiferroelectric (AFE) (Pb0.97La0.02)(Zr0.95Ti0.05)O3 (PLZT) thick films were fabricated by bulk silicon micromachining process. The conspicuous electrostrictive strain properties with phase transition of the AFE PLZT films induced by electric field were investigated. The resonant vibration velocity and tip deflection on a 650- μm-long cantilever were up to 6767 mm/s and 45.7 μm, under the square wave excitation with the voltage of 40 V, matched to the AFE-ferroelectric phase transition electric field of 210 kV/cm. The ratio of induced tip displacement and cantilever length per unit voltage [d(δ)/L/dV] was proposed to show the mutation response ability. In addition, the new AFE PLZT microcantilevers exhibited superior value of 10.77/kV, further higher than the traditional ones. Extensive application requirements for microdevices would be met in various fields of microelectromechanical systems.
Keywords :
antiferroelectric materials; cantilevers; electrostriction; ferroelectric devices; ferroelectric transitions; lanthanum compounds; lead compounds; micromachining; micromechanical devices; thick film devices; AFE PLZT films; AFE PLZT microcantilevers; AFE-ferroelectric phase transition electric field; MEMS device applications; PLZT; PLZT thick films; antiferroelectric thick film microcantilevers; bulk silicon micromachining process; cantilever length; conspicuous electrostrictive strain property; electrostrictive strain behavior; induced tip displacement; microdevices; microelectromechanical systems; mutation response ability; resonant vibration velocity; size 45.7 mum; size 650 mum; square wave excitation; tip deflection; voltage 40 V; Micromachining; Micromechanical devices; Resonant frequency; Silicon; Strain; Switches; Vibrations; Antiferroelectric thick film; electrostrictive strain; micro-cantilever; phase transition; tip deflection;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2013.2272211
Filename :
6562778
Link To Document :
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