• DocumentCode
    47361
  • Title

    Non-Invasive Recognition of Poorly Resolved Integrated Circuit Elements

  • Author

    Matlin, Erik ; Agrawal, Meena ; Stoker, David

  • Author_Institution
    SRI Int., Menlo Park, CA, USA
  • Volume
    9
  • Issue
    3
  • fYear
    2014
  • fDate
    Mar-14
  • Firstpage
    354
  • Lastpage
    363
  • Abstract
    We present a non-invasive method for recognition of components in a digital CMOS integrated circuit (IC). We use a confocal infrared laser scanning optical microscope to collect multimodal images through the backside of the IC. Individual modes correspond to passive reflectivity measurements or active measurements, such as light-induced voltage alteration. The modes are registered and stored in a multidimensional data cube. We apply a machine learning algorithm using a binary representation to identify a variety of data structures from transistors to entire logic cells. Because of the compact representation, objects can be detected rapidly. We show that by increasing the number of imaging modes used to develop the descriptor, we can significantly increase recognition accuracy. The approach allows recognition of poorly resolved components, whose primary distinguishing features are below traditional optical resolution limits, and is general enough to be applied to multiple design processes. We believe this represents a significant step toward a fully non-invasive IC reverse engineering system.
  • Keywords
    CMOS digital integrated circuits; data structures; electronic engineering computing; image recognition; integrated circuit design; learning (artificial intelligence); optical microscopy; reverse engineering; active measurement; binary representation; compact representation; component recognition; confocal infrared laser scanning optical microscope; data structures; digital CMOS IC; digital CMOS integrated circuit; fully-noninvasive IC reverse engineering system; imaging modes; light-induced voltage alteration; logic cells; machine learning algorithm; multidimensional data cube; multimodal images; multiple-design process; noninvasive recognition; object detection; passive reflectivity measurement; poorly-resolved integrated circuit elements; recognition accuracy; traditional optical resolution limits; transistors; Image resolution; Integrated circuits; Logistics; Microscopy; Optical microscopy; Reverse engineering; Image processing and computer vision; bag-of-words; ensemble learning; integrated circuits; non-invasive reverse engineering;
  • fLanguage
    English
  • Journal_Title
    Information Forensics and Security, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1556-6013
  • Type

    jour

  • DOI
    10.1109/TIFS.2013.2297518
  • Filename
    6701342