Title :
Effects of annealing and electromigration on intermetallic compound formation of Cu pillar bump
Author :
Kim, Byoung-Joon ; Lim, Gi-Tae ; Lee, Jang-Hee ; Kim, Jaedong ; Lee, Kiwook ; Park, Young-Bae ; Joo, Young-Chang
Author_Institution :
Dept. of Materials Science & Engineering, Seoul National Univ., Korea
Keywords :
Annealing; Electromigration; Intermetallic;
Conference_Titel :
Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on
Conference_Location :
Daejeon, Korea
Print_ISBN :
978-1-4244-1909-8
Electronic_ISBN :
978-1-4244-1910-4
DOI :
10.1109/EMAP.2007.4510319
