Title :
Solder joint reliability with variations of solder ball land design
Author_Institution :
CTO R&D Center / Package R&D Div., HynixSemiconductor Co., Korea
Conference_Titel :
Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on
Conference_Location :
Daejeon, Korea
Print_ISBN :
978-1-4244-1909-8
Electronic_ISBN :
978-1-4244-1910-4
DOI :
10.1109/EMAP.2007.4510326
