DocumentCode

473624

Title

Solder joint reliability with variations of solder ball land design

Author

Young Hy Jung

Author_Institution

CTO R&D Center / Package R&D Div., HynixSemiconductor Co., Korea

fYear

2007

fDate

19-22 Nov. 2007

Firstpage

1

Lastpage

21

Keywords

Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on

Conference_Location

Daejeon, Korea

Print_ISBN

978-1-4244-1909-8

Electronic_ISBN

978-1-4244-1910-4

Type

conf

DOI

10.1109/EMAP.2007.4510326

Filename

4510326