DocumentCode :
473625
Title :
Thermal behavior of Sn nanowires for nano-interconnection
Author :
Shin, Hosun ; Song, Jaeyong ; Yu, Jin
Author_Institution :
Korea Advanced Institute of Science & Technology (KAIST), Korea
fYear :
2007
fDate :
19-22 Nov. 2007
Firstpage :
1
Lastpage :
16
Keywords :
Aluminum oxide; Fabrication; Nanowires; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on
Conference_Location :
Daejeon, Korea
Print_ISBN :
978-1-4244-1909-8
Electronic_ISBN :
978-1-4244-1910-4
Type :
conf
DOI :
10.1109/EMAP.2007.4510332
Filename :
4510332
Link To Document :
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