Title :
Effects of W addition in Ni(P) UBM on the solder joint reliability
Author :
Jang, D.M. ; Yu, Jin
Author_Institution :
Center for Electronic Packaging Materials (CEPM), Dept. Materials Sci. & Eng., Korea Adv. Inst. Sci. & Tech. (KAIST), Daejon, Korea
Keywords :
Aging; Amorphous materials; Chromium; Crystallization; Iron; Nickel; Soldering; Tin; Zinc; Zirconium;
Conference_Titel :
Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on
Conference_Location :
Daejeon, Korea
Print_ISBN :
978-1-4244-1909-8
Electronic_ISBN :
978-1-4244-1910-4
DOI :
10.1109/EMAP.2007.4510337
