DocumentCode

473627

Title

Effects of W addition in Ni(P) UBM on the solder joint reliability

Author

Jang, D.M. ; Yu, Jin

Author_Institution

Center for Electronic Packaging Materials (CEPM), Dept. Materials Sci. & Eng., Korea Adv. Inst. Sci. & Tech. (KAIST), Daejon, Korea

fYear

2007

fDate

19-22 Nov. 2007

Firstpage

1

Lastpage

14

Keywords

Aging; Amorphous materials; Chromium; Crystallization; Iron; Nickel; Soldering; Tin; Zinc; Zirconium;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on

Conference_Location

Daejeon, Korea

Print_ISBN

978-1-4244-1909-8

Electronic_ISBN

978-1-4244-1910-4

Type

conf

DOI

10.1109/EMAP.2007.4510337

Filename

4510337