Title :
Recessed-Gate Enhancement-Mode GaN MOSFETs With a Double-Insulator Gate Providing 10-MHz Switching Operation
Author :
Kashiwagi, Junichi ; Fujiwara, Toshihito ; Akutsu, Minoru ; Ito, Noboru ; Chikamatsu, Kentaro ; Nakahara, Kouji
Author_Institution :
Power Electron. R&D Unit, ROHM Co., Ltd., Kyoto, Japan
Abstract :
Recessed-gate GaN metal-oxide-semiconductor field-effect transistors with a double-insulator gate configuration demonstrate 10-MHz switching operation of which delay time is <;35 ns. The recess structure is fabricated by etching the Al0.19Ga0.81N layers to expose their underlying AlN layers. The devices include a thermally oxidized AlN layer onto which an Al2O3 film is formed by atomic layer deposition, which works as a gate insulator. This structure performs enhancement-mode operation with a typical threshold voltage of 1.4 V. A maximum drain current of 158.3 mA/mm is achieved at 6 V gate bias and maximum transconductance is 52.1 mS/mm at 10 V drain bias.
Keywords :
III-V semiconductors; MOSFET; aluminium compounds; atomic layer deposition; etching; gallium compounds; oxidation; semiconductor switches; wide band gap semiconductors; Al0.19Ga0.81N; Al2O3; GaN; atomic layer deposition; delay time; double-insulator gate configuration; enhancement-mode operation; etching; frequency 10 MHz; gate insulator; maximum drain current; maximum transconductance; recess structure; recessed-gate enhancement-mode MOSFET; recessed-gate metal-oxide-semiconductor field-effect transistors; switching operation; thermally oxidized layer; threshold voltage; voltage 1.4 V; voltage 10 V; voltage 6 V; Aluminum gallium nitride; Delays; Gallium nitride; III-V semiconductor materials; Logic gates; MOSFET; Switches; 10-MHz switching operation; ${rm Al}_{2}{rm O}_{3}$; atomic layer deposition (ALD); double-insulator gate; enhancement-mode (E-mode);
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2013.2272491