Simulation of Moisture Diffusion in Sealing Layers by using Analogous Thermal Simulation

Author

Tibeica, C. ; Voicu, R. ; Moagar-Poladian, V.

Author_Institution

Nat. Inst. for R&D in Microtechnologies, Bucharest

Volume

1

fYear

2007

fDate

Oct. 15 2007-Sept. 17 2007

Firstpage

95

Lastpage

98

Abstract

This paper presents a numerical model for the simulation of moisture absorption in packaged microsystems based on analogy between mechanical and thermal diffusion equations. This approach could be useful when certain simulation software, such as CoventorWare, does not have the capability of moisture diffusion simulation. We present the first results concerning the simulation of moisture absorption and time necessary to reach a certain concentration of moisture in the package. Also, the obtained distribution of moisture concentration inside the package´s material could be further used for simulation of hygroscopic stress through hygroswelling.

Keywords

packaging; thermal diffusion; CoventorWare; analogous thermal simulation; hygroscopic stress; mechanical diffusion equations; moisture absorption; moisture diffusion; packaged microsystems; sealing layers; thermal diffusion equations; Absorption; Differential equations; Heat transfer; Micromechanical devices; Moisture; Packaging; Polymers; Stress; Thermal conductivity; Wafer scale integration; MEMS; moisture diffusion; package; thermal diffusion;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Conference, 2007. CAS 2007. International

Conference_Location

Sinaia

ISSN

1545-827X

Print_ISBN

978-1-4244-0847-4

Type

conf

DOI

10.1109/SMICND.2007.4519655

Filename

4519655