Profiled Metal - Ceramic Matrices for MEMS Application

Author

Anton, Cornel ; Lecompte, Jean Pierre ; Muntean, Marcela

Author_Institution

Nat. Inst. for R&D in Microtechnologies, Bucharest

Volume

1

fYear

2007

fDate

Oct. 15 2007-Sept. 17 2007

Firstpage

123

Lastpage

126

Abstract

The present paper refers to realization of profiled ceramic micropackages (leadless inverted devices) for the mounting of MEMS application. Using corundum ceramic and electronic purity materials, the ceramic micropackages have been realized by adapting technological processes (deposition of metallic films, etching, etc.) and equipment specific to the electronic component industry. The joining of the gold terminals of the MEMS structure is performed by the gold - gold diffusion technique on the golden pads of the ceramic profiled matrices.

Keywords

ceramic packaging; micromechanical devices; MEMS; corundum ceramic; electronic component industry; electronic purity materials; gold-gold diffusion technique; leadless inverted devices; profiled ceramic micropackages; profiled metal ceramic matrices; Ceramics; Chemical elements; Electronic mail; Gold; Inorganic materials; Manufacturing; Micromechanical devices; Substrates; Temperature; Transmission line matrix methods; MEMS-Application; Profiled-Ceramic;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Conference, 2007. CAS 2007. International

Conference_Location

Sinaia

ISSN

1545-827X

Print_ISBN

978-1-4244-0847-4

Type

conf

DOI

10.1109/SMICND.2007.4519662

Filename

4519662