Title :
Profiled Metal - Ceramic Matrices for MEMS Application
Author :
Anton, Cornel ; Lecompte, Jean Pierre ; Muntean, Marcela
Author_Institution :
Nat. Inst. for R&D in Microtechnologies, Bucharest
fDate :
Oct. 15 2007-Sept. 17 2007
Abstract :
The present paper refers to realization of profiled ceramic micropackages (leadless inverted devices) for the mounting of MEMS application. Using corundum ceramic and electronic purity materials, the ceramic micropackages have been realized by adapting technological processes (deposition of metallic films, etching, etc.) and equipment specific to the electronic component industry. The joining of the gold terminals of the MEMS structure is performed by the gold - gold diffusion technique on the golden pads of the ceramic profiled matrices.
Keywords :
ceramic packaging; micromechanical devices; MEMS; corundum ceramic; electronic component industry; electronic purity materials; gold-gold diffusion technique; leadless inverted devices; profiled ceramic micropackages; profiled metal ceramic matrices; Ceramics; Chemical elements; Electronic mail; Gold; Inorganic materials; Manufacturing; Micromechanical devices; Substrates; Temperature; Transmission line matrix methods; MEMS-Application; Profiled-Ceramic;
Conference_Titel :
Semiconductor Conference, 2007. CAS 2007. International
Conference_Location :
Sinaia
Print_ISBN :
978-1-4244-0847-4
DOI :
10.1109/SMICND.2007.4519662
