Challenges on design complexities for advanced wireless silicon systems

The global wireless landscape continues to change as demand for 3G technology accelerates. Qualcomm is meeting the challenge with its highly integrated SoC solutions that enable customers worldwide to bring more advanced consumer devices to market faster. Relationships and tight collaboration continue to play an integral role in product development, as it becomes more crucial than ever for partnering companies to tackle complex design issues through synergistic groups such as EDA partners, foundry partners and customers. Technology migration with the right approach is also key as chipset design continues to evolve rapidly, bringing a whole new set of design challenges to semiconductor companies. Jha will elaborate on these present and future trends and reveal how collaborative business models are changing the game in chipset design.