DocumentCode
474482
Title
IFRA: Instruction Footprint Recording and Analysis for post-silicon bug localization in processors
Author
Park, Sung-Boem ; Mitra, Subhasish
Author_Institution
Dept. of Electr. Eng., Stanford Univ., Stanford, CA
fYear
2008
fDate
8-13 June 2008
Firstpage
373
Lastpage
378
Abstract
The objective of IFRA, instruction footprint recording and analysis, is to overcome the challenges associated with a very expensive step in post-silicon validation of processors - bug localization in a system setup. IFRA consists of special design and analysis techniques required to bridge a major gap between system-level and circuit-level debug. Special hardware recorders, called footprint recording structures (FRS´s), record semantic information about data and control flows of instructions passing through various design blocks of a processor. This information is recorded concurrently during normal operation of a processor in a post-silicon system validation setup. Upon detection of a problem, the recorded information is scanned out and analyzed for bug localization. Special program analysis techniques, together with the binary of the application executed during post-silicon validation, are used for the analysis. IFRA does not require full system-level reproduction of bugs or system-level simulation. Simulation results on a complex super-scalar processor demonstrate that IFRA is effective in accurately localizing bugs with very little impact on overall chip area.
Keywords
program debugging; program verification; circuit-level debug; instruction footprint recording and analysis; post-silicon bug localization; post-silicon system validation setup; post-silicon validation; program analysis techniques; semantic information; system-level debug; Analytical models; Bridge circuits; Circuit simulation; Clocks; Computer bugs; Costs; Fault detection; Hardware; Information analysis; Reproducibility of results; Validation; debug; design for debug; verification;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2008. DAC 2008. 45th ACM/IEEE
Conference_Location
Anaheim, CA
ISSN
0738-100X
Print_ISBN
978-1-60558-115-6
Type
conf
Filename
4555846
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