Electric field integral equation combined with cylindrical conduction mode basis functions for electrical modeling of three-dimensional interconnects

Author

Han, Ki Jin ; Swaminathan, Madhavan ; Engin, Ege

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA

fYear

2008

fDate

8-13 June 2008

Firstpage

421

Lastpage

424

Abstract

For the modeling of interconnect in three-dimensional packagings, this paper proposes a method based on the electric field integral equation (EFIE) with cylindrical conduction mode basis functions (CMBF). The bases are defined to describe arbitrary skin and proximity effects, and partial impedances are obtained from the formulation of the EFIE with CMBF´s. Examples of several 3D interconnects verify that the proposed method is efficient in speed and memory.

Keywords

electric field integral equations; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; skin effect; 3D interconnects; 3D packaging; arbitrary skin effects; cylindrical conduction mode basis functions; electric field integral equation; electrical modeling; partial impedances; proximity effects; Conductors; Current density; Equivalent circuits; Impedance; Integral equations; Integrated circuit interconnections; Packaging; Proximity effect; Skin; Transmission line matrix methods; 3-D integration; conduction mode basis function; electric field integral equation; proximity effect; skin effect; system-in-package;

fLanguage

English

Publisher

ieee

Conference_Titel

Design Automation Conference, 2008. DAC 2008. 45th ACM/IEEE

Conference_Location

Anaheim, CA

ISSN

0738-100X

Print_ISBN

978-1-60558-115-6

Type

conf

Filename

4555854