Electric field integral equation combined with cylindrical conduction mode basis functions for electrical modeling of three-dimensional interconnects

For the modeling of interconnect in three-dimensional packagings, this paper proposes a method based on the electric field integral equation (EFIE) with cylindrical conduction mode basis functions (CMBF). The bases are defined to describe arbitrary skin and proximity effects, and partial impedances are obtained from the formulation of the EFIE with CMBF´s. Examples of several 3D interconnects verify that the proposed method is efficient in speed and memory.