• DocumentCode
    474503
  • Title

    ELIAD: Efficient lithography aware detailed router with compact post-OPC printability prediction

  • Author

    Cho, Minsik ; Yuan, Kun ; Ban, Yongchan ; Pan, David Z.

  • Author_Institution
    ECE Dept., Univ. of Texas at Austin, Austin, TX
  • fYear
    2008
  • fDate
    8-13 June 2008
  • Firstpage
    504
  • Lastpage
    509
  • Abstract
    In this paper, we present ELIAD, an efficient lithography aware detailed router to optimize silicon image after optical proximity correction (OPC) in a correct-by-construction manner. We first propose a compact post-OPC litho-metric for a detailed router based on statistical characterization. We characterize the interferences among weak grids filled with one of predefined litho-prone shapes (e.g., jog-corner, via, line-end). Our litho-metric derived from the characterization shows high fidelity to total edge placement error (EPE) in large scale, compared with Calibre-OPC/ORC. As a chip itself is in the largest scale, ELIAD powered by the proposed metric can enhance the overall post-OPC printed silicon image. Experimental results on 65 nm industrial circuits show that ELIAD outperforms a ripup/rerouting approach such as RADAR [17] with 8times more EPE hotspot reduction and 12times speedup. Also, compared with a conventional detailed router, ELIAD is only about 50% slower.
  • Keywords
    proximity effect (lithography); ELIAD; compact post-OPC lithometric; compact post-OPC printability prediction; correct-by-construction manner; edge placement error; efficient lithography aware detailed router; optical proximity correction; silicon image; statistical characterization; Algorithm design and analysis; Costs; Lithography; Manufacturing; Optical noise; Permission; Routing; Silicon; Timing; Very large scale integration; Lithography; Manufacturability; OPC; Routing; VLSI;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2008. DAC 2008. 45th ACM/IEEE
  • Conference_Location
    Anaheim, CA
  • ISSN
    0738-100X
  • Print_ISBN
    978-1-60558-115-6
  • Type

    conf

  • Filename
    4555869