Title :
Design and CAD for 3D integrated circuits
Author :
Franzon, Paul D. ; Davis, William Rhett ; Steer, Michael B. ; Lipa, Steve ; Eun Chu Oh ; Thorolfsson, Thor ; Doxsee, T. ; Berkeley, S. ; Shani, B. ; Obermiller, Kurt
Author_Institution :
ECE, NC State Univ., Raleigh, NC
Abstract :
High density through silicon vias (TSV) can be used to build 3DICs that enable unique applications in computing, signal processing and memory intensive systems. This paper presents several case studies that are uniquely enhanced through 3D implementation, including a 3D CAM, an FFT processor, and a SAR processor. The CAD flow used to implement for these designs is described. 3DIC requires higher fidelity thermal modeling than 2DIC design. The rationale for this requirement is established and a possible solution is presented.
Keywords :
circuit CAD; elemental semiconductors; integrated circuit design; silicon; 3D integrated circuits; CAD; FFT processor; SAR processor; Si; TSV; thermal modeling; through silicon vias; Bandwidth; Costs; Delay; Design automation; Integrated circuit interconnections; Logic; Silicon; Thermal conductivity; Three-dimensional integrated circuits; Through-silicon vias; 3DIC; TSV; Thermal Modeling; Through Silicon Via;
Conference_Titel :
Design Automation Conference, 2008. DAC 2008. 45th ACM/IEEE
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-60558-115-6
