Title :
Why should we do 3D integration?
Author :
Haensch, Wilfried
Author_Institution :
IBM TJ Watson Res. Center, Yorktown Heights, NY
Abstract :
3D integration offers a technology that meets the requirements of the current trend in high performance microprocessors. It offers the opportunity to continue the performance trends the industry enjoyed in the past. To take advantage of this opportunity system architecture and design needs to utilize the new possibilities that 3D integration provides.
Keywords :
integrated circuit design; microprocessor chips; 3D integration; microprocessor chips; stacking cores; CMOS technology; Costs; High performance computing; Maintenance engineering; Materials science and technology; Microprocessor chips; Parallel processing; Power engineering and energy; Random access memory; Stress; 3D integration; many core systems; memory sub system;
Conference_Titel :
Design Automation Conference, 2008. DAC 2008. 45th ACM/IEEE
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-60558-115-6
