DocumentCode
474544
Title
An integrated nonlinear placement framework with congestion and porosity aware buffer planning
Author
Chen, Tung-Chieh ; Chakraborty, Ashutosh ; Pan, David Z.
Author_Institution
Grad. Inst. of Electron. Eng., Nat. Taiwan Univ., Taipei
fYear
2008
fDate
8-13 June 2008
Firstpage
702
Lastpage
707
Abstract
Due to skewed scaling of interconnect versus cell delay in deep submicron CMOS, modern VLSI timing closure requires extensive buffer insertion. Inserting a large number of buffers may cause not only dramatic cell migration but also routing hotspots. If buffering is not controlled well, it may fail to close a design. Placement with buffer porosity (i.e., cell density) awareness can allocate space for inserting these buffers, and buffering with congestion awareness can improve the routability. Therefore, there is essential need for a placement framework with explicit porosity and congestion control. In this paper, we propose the first integrated nonlinear placement framework with porosity and congestion aware buffer planning. We demonstrate the integration of increasingly refined cell porosity and routing congestion aware buffer planning and insertion methodology in a high quality nonlinear placer. Our experiments show the improvement of average routing overflow by 69%, average wirelength by 28% and average buffer count by 40%, compared with the traditional placement framework without buffer planning.
Keywords
CMOS integrated circuits; VLSI; buffer circuits; circuit optimisation; integrated circuit design; integrated circuit interconnections; network routing; porosity; average buffer count; average routing overflow; average wirelength; cell delay; cell porosity; congestion aware buffer planning; deep submicron CMOS; extensive buffer insertion length; high quality nonlinear placer; integrated nonlinear placement framework; interconnect optimization; interconnects skewed scaling; modern VLSI timing closure; porosity aware buffer planning; routing congestion; Algorithm design and analysis; Delay; Explosions; Integrated circuit interconnections; Integrated circuit technology; Routing; Space technology; Timing; Very large scale integration; Wire; Buffer; Physical Design; Placement; VLSI;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2008. DAC 2008. 45th ACM/IEEE
Conference_Location
Anaheim, CA
ISSN
0738-100X
Print_ISBN
978-1-60558-115-6
Type
conf
Filename
4555910
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