Title :
DC positive discharge performance of rod-plane short air gap under rain conditions
Author :
Xingliang Jiang ; Yao Yuan ; Maoqiang Bi ; Yong Du ; Jianguo Ma
Author_Institution :
State Key Lab. of Power Transm. Equip. & Syst. Security & New Technol., Chongqing Univ., Chongqing, China
Abstract :
To study the discharge performance of air gap under rain conditions and provide reference to the selection of clearance distance of external insulation in strong rain, this paper explored the influence of different environment conditions, rain intensity, rain conductivity, and ambient temperature on the dc positive breakdown voltage of rodplane air gap in the artificial climate chamber and at Xuefeng Mountain Natural Site. It is shown that the discharge voltage of rod-plane short air gap in wet condition is slightly higher than that in the dry condition; light rain has little influence on the positive dc discharge voltage of rod-plane short air gap. The relative discharge voltage of air gap decreases with an increase of rain intensity and rain conductivity with 2.2% to 0.2% / (mm/min), 1.4% to 0.1% / (100 μS/cm), respetively; and it is associated with the increase of ambient temperature with 0.3% to 0.1% / °C. In addition, several computations were carried out with different droplet sizes in rod-plane air gap. It can be indicated that the maximum electric field in the air gap increases with the increase of the radius and number of droplets.
Keywords :
air gaps; discharges (electric); drops; insulators; rain; DC positive discharge performance; Xuefeng Mountain Natural Site; ambient temperature; artificial climate chamber; dc positive breakdown voltage; discharge voltage; droplet sizes; electric field; environment conditions; external insulation; rain conditions; rain conductivity; rain intensity; rod-plane short air gap; Atmospheric measurements; Breakdown voltage; Companies; Conductivity; Discharges (electric); Humidity; Rain; Rain intensity; air gap; ambient temperature; dcdischarge voltage; field tests; rain conductivity;
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
DOI :
10.1109/TDEI.2013.6451347