Title :
Influence of copper ions in transformer oil properties and adsorption treatment
Author :
Wan, Tao Ruan ; Qian, Hua ; Feng, Baicheng ; Zhou, Zhengchun ; Gong, S.K. ; Hu, Xiaonan
Author_Institution :
Hunan Electr. Power Corp. Res. Inst., Changsha, China
Abstract :
The dissolution of copper with trace acid, oxygen, moisture, nitrogen compounds, and corrosive sulfur in oil formed copper ions. A transformer oil with 7.0 mg/kg copper ion was treated via the adsorption method. The efficiency of adsorbent was raised with the increase of addition amount and temperature. In the adsorption process, the copper ions, interfacial tension, water content, acid value, volume resistivity, and dielectric loss tangent tan δ of oil were tested, and the relationship between copper ions and electrical properties was investigated. In 140 h, the copper ions decreased to 0.5 mg/kg, the dielectric loss tangent from 2.19% to 0.07%, and the volume resistivity from 0.67×1012 Ωcm to 7.05×1012 Ωcm. Moreover, the antioxidant content, oxidation stability, and transformer insulation resistance before and after the adsorption treatment were analyzed. The adsorption treatment was effective in elevating the transformer insulation resistance from about one to ten thousand.
Keywords :
adsorption; copper; dielectric losses; dissolving; nitrogen compounds; oxidation; power transformer insulation; surface tension; transformer oil; Cu; adsorbent efficiency; adsorption treatment method; antioxidant content; copper dissolution; corrosive sulfur; dielectric loss tangent; electrical property; interfacial tension; moisture; nitrogen compounds; oil formed copper ions; oxidation stability; time 140 h; trace acid; transformer insulation resistance; transformer oil property; volume resistivity; water content; Adsorption; Copper; Ions; Oil insulation; Power transformer insulation; Resistance; Transformer oil; adsorptiontreatment; copper dissolution; copper ion; transformer insulation resistance;
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
DOI :
10.1109/TDEI.2013.6451352